Signal and Power Integrity---Second Edition
[i=s] 本帖最后由 ripple 于 2010-2-28 21:49 编辑 [/i]Signal Integrity:Simplified经典蓝宝书的第二版，增加了Power Integrity部分，全书也增加了不少！
具体章节如下：
Signal and Power Integrity - Simplified, 2nd Edition已经出版，比第一版增加了12、13章，篇幅增加150页左右。
Table of Contents
Preface to the Second Edition xv
Preface to the First Edition xvii
Acknowledgments xxiii
About the Author xxv
Chapter 1: Signal Integrity Is in Your Future 1
1.1 What Is Signal Integrity? 2
1.2 Signal Quality on a Single Net 5
1.3 Cross Talk 9
1.4 Rail-Collapse Noise 11
1.5 Electromagnetic Interference (EMI) 13
1.6 Two Important Signal Integrity Generalizations 16
1.7 Trends in Electronic Products 16
1.8 The Need for a New Design Methodology 22
1.9 A New Product Design Methodology 23
1.10 Simulations 24
1.11 Modeling and Models 27
1.12 Creating Circuit Models from Calculation 30
1.13 Three Types of Measurements 35
1.14 The Role of Measurements 38
1.15 The Bottom Line 39
Chapter 2: Time and Frequency Domains 43
2.1 The Time Domain 44
2.2 Sine Waves in the Frequency Domain 46
2.3 Shorter Time to a Solution in the Frequency Domain 48
2.4 Sine Wave Features 49
2.5 The Fourier Transform 51
2.6 The Spectrum of a Repetitive Signal 53
2.7 The Spectrum of an Ideal Square Wave 55
2.8 From the Frequency Domain to the Time Domain 57
2.9 Effect of Bandwidth on Rise Time 58
2.10 Bandwidth and Rise Time 62
2.11 What Does Significant Mean? 63
2.12 Bandwidth of Real Signals 67
2.13 Bandwidth and Clock Frequency 68
2.14 Bandwidth of a Measurement 70
2.15 Bandwidth of a Model 72
2.16 Bandwidth of an Interconnect 74
2.17 The Bottom Line 78
Chapter 3: Impedance and Electrical Models 81
3.1 Describing Signal-Integrity Solutions in Terms of Impedance 82
3.2 What Is Impedance? 84
3.3 Real Versus Ideal Circuit Elements 86
3.4 Impedance of an Ideal Resistor in the Time Domain 88
3.5 Impedance of an Ideal Capacitor in the Time Domain 89
3.6 Impedance of an Ideal Inductor in the Time Domain 92
3.7 Impedance in the Frequency Domain 94
3.8 Equivalent Electrical Circuit Models 99
3.9 Circuit Theory and SPICE 101
3.10 Introduction to Modeling 105
3.11 The Bottom Line 110
Chapter 4: The Physical Basis of Resistance 113
4.1 Translating Physical Design into Electrical Performance 114
4.2 The Only Good Approximation for the Resistance of Interconnects 115
4.3 Bulk Resistivity 118
4.4 Resistance per Length 119
4.5 Sheet Resistance 121
4.6 The Bottom Line 124
Chapter 5: The Physical Basis of Capacitance 127
5.1 Current Flow in Capacitors 128
5.2 The Capacitance of a Sphere 130
5.3 Parallel Plate Approximation 131
5.4 Dielectric Constant 133
5.5 Power and Ground Planes and Decoupling Capacitance 135
5.6 Capacitance per Length 138
5.7 2D Field Solvers 143
5.8 Effective Dielectric Constant 146
5.9 The Bottom Line 150
Chapter 6: The Physical Basis of Inductance 151
6.1 What Is Inductance? 151
6.2 Inductance Principle #1: There Are Circular Rings of Magnetic-Field Lines Around All Currents 152
6.3 Inductance Principle #2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It 154
6.4 Self-Inductance and Mutual Inductance 156
6.5 Inductance Principle #3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor 158
6.6 Partial Inductance 161
6.7 Effective, Total, or Net Inductance and Ground Bounce 167
6.8 Loop Self- and Mutual Inductance 173
6.9 The Power-Distribution Network (PDN) and Loop Inductance 178
6.10 Loop Inductance per Square of Planes 183
6.11 Loop Inductance of Planes and Via Contacts 184
6.12 Loop Inductance of Planes with a Field of Clearance Holes 187
6.13 Loop Mutual Inductance 188
6.14 Equivalent Inductance of Multiple Inductors 189
6.15 Summary of Inductance 191
6.16 Current Distributions and Skin Depth 193
6.17 High-Permeability Materials 202
6.18 Eddy Currents 204
6.19 The Bottom Line 206
Chapter 7: The Physical Basis of Transmission Lines 209
7.1 Forget the Word Ground 210
7.2 The Signal 211
7.3 Uniform Transmission Lines 212
7.4 The Speed of Electrons in Copper 214
7.5 The Speed of a Signal in a Transmission Line 215
7.6 Spatial Extent of the Leading Edge 219
7.7 “Be the Signal” 220
7.8 The Instantaneous Impedance of a Transmission Line 224
7.9 Characteristic Impedance and Controlled Impedance 227
7.10 Famous Characteristic Impedances 230
7.11 The Impedance of a Transmission Line 233
7.12 Driving a Transmission Line 238
7.13 Return Paths 241
7.14 When Return Paths Switch Reference Planes 244
7.15 A First-Order Model of a Transmission Line 257
7.16 Calculating Characteristic Impedance with Approximations 262
7.17 Calculating the Characteristic Impedance with a 2D Field Solver 265
7.18 An n-Section Lumped Circuit Model 270
7.19 Frequency Variation of the Characteristic Impedance 278
7.20 The Bottom Line 279
Chapter 8: Transmission Lines and Reflections 281
8.1 Reflections at Impedance Changes 282
8.2 Why Are There Reflections? 284
8.3 Reflections from Resistive Loads 288
8.4 Source Impedance 290
8.5 Bounce Diagrams 292
8.6 Simulating Reflected Waveforms 295
8.7 Measuring Reflections with a TDR 295
8.8 Transmission Lines and Unintentional Discontinuities 299
8.9 When to Terminate 301
8.10 The Most Common Termination Strategy for Point-to-Point Topology 304
8.11 Reflections from Short Series Transmission Lines 306
8.12 Reflections from Short-Stub Transmission Lines 309
8.13 Reflections from Capacitive End Terminations 311
8.14 Reflections from Capacitive Loads in the Middle of a Trace 314
8.15 Capacitive Delay Adders 317
8.16 Effects of Corners and Vias 319
8.17 Loaded Lines 325
8.18 Reflections from Inductive Discontinuities 327
8.19 Compensation 331
8.20 The Bottom Line 334
Chapter 9: Lossy Lines, Rise-Time Degradation, and Material Properties 337
9.1 Why Worry About Lossy Lines? 338
9.2 Losses in Transmission Lines 340
9.3 Sources of Loss: Conductor Resistance and Skin Depth 342
9.4 Sources of Loss: The Dielectric 346
9.5 Dissipation Factor 351
9.6 The Real Meaning of Dissipation Factor 354
9.7 Modeling Lossy Transmission Lines 360
9.8 Characteristic Impedance of a Lossy Transmission Line 367
9.9 Signal Velocity in a Lossy Transmission Line 369
9.10 Attenuation and the dB 371
9.11 Attenuation in Lossy Lines 376
9.12 Measured Properties of a Lossy Line in the Frequency Domain 385
9.13 The Bandwidth of an Interconnect 390
9.14 Time-Domain Behavior of Lossy Lines 397
9.15 Improving the Eye Diagram of a Transmission Line 400
9.16 Pre-emphasis and Equalization 402
9.17 The Bottom Line 403
Chapter 10: Cross Talk in Transmission Lines 405
10.1 Superposition 406
10.2 Origin of Coupling: Capacitance and Inductance 407
10.3 Cross Talk in Transmission Lines: NEXT and FEXT 409
10.4 Describing Cross Talk 411
10.5 The SPICE Capacitance Matrix 413
10.6 The Maxwell Capacitance Matrix and 2D Field Solvers 417
10.7 The Inductance Matrix 424
10.8 Cross Talk in Uniform Transmission Lines and Saturation Length 425
10.9 Capacitively Coupled Currents 431
10.10 Inductively Coupled Currents 435
10.11 Near-End Cross Talk 438
10.12 Far-End Cross Talk 441
10.13 Decreasing Far-End Cross Talk 448
10.14 Simulating Cross Talk 451
10.15 Guard Traces 457
10.16 Cross Talk and Dielectric Constant 464
10.17 Cross Talk and Timing 466
10.18 Switching Noise 469
10.19 Summary of Reducing Cross Talk 473
10.20 The Bottom Line 474
Chapter 11: Differential Pairs and Differential Impedance 475
11.1 Differential Signaling 476
11.2 A Differential Pair 480
11.3 Differential Impedance with No Coupling 482
11.4 The Impact from Coupling 486
11.5 Calculating Differential Impedance 493
11.6 The Return-Current Distribution in a Differential Pair 496
11.7 Odd and Even Modes 502
11.8 Differential Impedance and Odd-Mode Impedance 507
11.9 Common Impedance and Even-Mode Impedance 508
11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components 511
11.11 Velocity of Each Mode and Far-End Cross Talk 513
11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair 519
11.13 Measuring Even- and Odd-Mode Impedance 520
11.14 Terminating Differential and Common Signals 522
11.15 Conversion of Differential to Common Signals 529
11.16 EMI and Common Signals 534
11.17 Cross Talk in Differential Pairs 539
11.18 Crossing a Gap in the Return Path 542
11.19 To Tightly Couple or Not to Tightly Couple 544
11.20 Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements 546
11.21 The Characteristic Impedance Matrix 550
11.22 The Bottom Line 553
Chapter 12: S-Parameters for Signal Integrity Applications 555
12.1 S-Parameters, the New Universal Metric 555
12.2 What Are S-Parameters? 557
12.3 Basic S-Parameter Formalism 559
12.4 S-Parameter Matrix Elements 562
12.5 Simulating Return and Insertion Loss 567
12.6 A Transparent Interconnect 570
12.7 Changing the Port Impedance 573
12.8 The Phase of S21 for a Uniform 50-Ohm Transmission Line 574
12.9 The Magnitude of S21 for a Uniform Transmission Line 577
12.10 Coupling to Other Transmission Lines 582
12.11 Insertion Loss for Non-50-Ohm Transmission Lines 589
12.12 Data-Mining S-Parameters 594
12.13 Single-Ended and Differential S-Parameters 596
12.14 Differential Insertion Loss 601
12.15 The Mode Conversion Terms 605
12.16 Converting to Mixed-Mode S-Parameters 607
12.17 Time and Frequency Domains 609
12.18 The Bottom Line 613
Chapter 13: The Power Distribution Network (PDN) 615
13.1 The Problem 615
13.2 The Root Cause 618
13.3 The Most Important Design Guidelines for the PDN 620
13.4 Establishing the Target Impedance Is Hard 621
13.5 Every Product Has a Unique PDN Requirement 629
13.6 Engineering the PDN 631
13.7 The VRM 633
13.8 Simulating Impedance with SPICE 635
13.9 On-die Capacitance 637
13.10 The Package Barrier 639
13.11 The PDN with No Decoupling Capacitors 644
13.12 The MLCC Capacitor 646
13.13 The Equivalent Series Inductance 650
13.14 Approximating Loop Inductance 652
13.15 Optimizing the Mounting of Capacitors 661
13.16 Combining Capacitors in Parallel 667
13.17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors 673
13.18 Selecting Capacitor Values 675
13.19 Estimating the Number of Capacitors Needed 681
13.20 How Much Does a nH Cost? 683
13.21 Quantity or Specific Values? 687
13.22 Sculpting the Impedance Profiles: The Frequency Domain Target Impedance (FDTI) Method 692
13.23 When Every pH Counts 699
13.24 Location, Location, Location 703
13.25 When Spreading Inductance Is the Limitation 707
13.26 The Chip View 710
13.27 Bringing It All Together 713
13.28 The Bottom Line 717
Appendix A: 100 General Design Guidelines to Minimize Signal-Integrity Problems 719
Appendix B: 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects 727
Appendix C: Selected References 739
第二版序言：
Since the publication of the first edition of Signal Integrity—Simplified, the princi-
ples of signal integrity haven’t changed. What has changed, though, is the prolific
use of high-speed serial links and the critical role power integrity now plays in the
success or failure of new product introductions.
In addition to fleshing out more details and examples in many of the chap-
ters, especially on differential pairs and losses, two new chapters have been added
to this second edition to provide a strong foundation to meet the needs of today’s
engineers and designers.
This first new chapter—Chapter 12—provides a thorough introduction to the
use of S-parameters in signal integrity applications. If you deal with any high-
speed serial links, you will encounter S-parameters. Because they are written in
the foreign language of the frequency domain, they are intimidating to the high-
speed digital designer. Chapter 12, like all the chapters in this book, provides a
solid foundation in understanding this formalism and enables all engineers to har-
ness the great power of S-parameters.
Chapter 13, the second new chapter, is on power integrity. These issues
increasingly fall in the lap of the design engineer. With higher speed applications,
interconnects in the power distribution path affect not just power delivery, but also
signals’ return paths and passing an EMC certification test.
We start at the beginning and illustrate the role of the power distribution
interconnects and how design and technology selection can make or break the per-
formance of the power distribution network. The essential principles of plane
impedance, spreading inductance, decoupling capacitors, and the loop inductance
of capacitors are introduced. This valuable insight helps feed the intuition of engi-
neers enabling them to apply the power of their creativity to synthesize new
designs. Hand in hand with the creation of a design is the analysis of its perfor-
mance so that cost-performance trade-offs can be explored and the PDN imped-
ance profile can be sculpted to perfection.
If you are new to signal integrity, this second edition of Signal and Power
Integrity—Simplified provides your starting place to build a strong foundation and
empowers you to get your new signal integrity designs right the first time, every
time. 封面和前言
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[attach]793[/attach] 第一章：
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[attach]795[/attach] 第二章：
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[attach]797[/attach] 前面和第一版基本没有变化 看来一直到第十一章都一样
Chapter 12 增加S-Parameter
Chapter 13 新增PDN (power distribution network)
似乎全书还是未涉及GHz的Microwave等级 (我认为的正题),只是看到象鼻 (再卖一本书)
请share Chapter 12 及 13? 响应calabazas的需求，优先上传这两张。21：45之后才能上传，昨天用完了上传的大小。 第12章，一共5个压缩包：
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[attach]807[/attach] 12章第5个part
[attach]808[/attach] 明天继续！ 谢谢，楼主。网上有卖了吗？ 亚马逊有卖的 [url]http://tiny.cc/r7KiP[/url] [quote]亚马逊有卖的 [url]http://tiny.cc/r7KiP[/url]
[size=2][color=#999999]admin 发表于 2010-3-2 10:42[/color] [url=http://www.pcbsi.com/redirect.php?goto=findpost&pid=4546&ptid=841][img]http://www.pcbsi.com/images/common/back.gif[/img][/url][/size][/quote]
亚马逊和ebay上都有，不过只有英文版本，国内的影印版本还好像没有。另外，原价很贵，好像好几十美元。
如果打算买原版，可以买本二手的，有时会便宜一些。 电子档直接去打印出来装订挺不错
然后再做个彩页当封面
挺好 [quote]电子档直接去打印出来装订挺不错
然后再做个彩页当封面
挺好
[size=2][color=#999999]袁荣盛 发表于 2010-3-2 11:56[/color] [url=http://www.pcbsi.com/redirect.php?goto=findpost&pid=4548&ptid=841][img]http://www.pcbsi.com/images/common/back.gif[/img][/url][/size][/quote]
袁兄，:handshake :lol 被你说中了。我就打印了几本书！ 感谢分享! Chap13? 感谢分享 chapter 13:
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[attach]814[/attach] chapter13一共9个压缩包。
第五个：
[attach]815[/attach] Part6-Part9:
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